欧美高清视频一区-国产色婷婷精品综合在线播放-HD中字播放,日韩欧美在线观看一区二区三区,极品美女高潮,91精品1区

Chip packaging flexible functional composite film

Based on the polymer film with high dielectric and thermal stability, it integrates different functional coatings such as viscosity, conductivity, photosensitive, etc., to realize the packaging auxiliary composite film that meets the needs of different preparation processes and scales in the chip processing technology.

Advantages

High and low temperature resistance

Dimensionally stable

Easy to peel

Strong stickiness

Product Series

Consult now

We are committed to the innovation and development of new composite materials

Name
Email
Telephone
Enterprise
Need

? ? ? ? ? Submit? ? ? ? ??

  • 0510-85626022
  • info@kemaite.com